dc.contributor.author | ROBINSON, ANTHONY | |
dc.date.accessioned | 2009-08-31T11:22:35Z | |
dc.date.available | 2009-08-31T11:22:35Z | |
dc.date.issued | 2009 | |
dc.date.submitted | 2009 | en |
dc.identifier.citation | A. J. Robinson 'A Thermal-hydraulic comparison of liquid microchannel and impinging liquid jet array heat sinks for high power electronics cooling' in IEEE Transactions on Components and Packaging Technologies, 32, (2), 2009, pp 347 - 357 | en |
dc.identifier.other | Y | |
dc.identifier.other | Y | en |
dc.description | PUBLISHED | en |
dc.description.abstract | In this paper, two single-phase liquid cooling strategies
for electronics thermal management are compared and contrasted;
impinging jet arrays and laminar flow in microchannels.
The comparison is posed for a situation in which an electronic device
must dissipate 250 W/cm? while being maintained at a temperature
of 85 C. The calculations indicate that both the impinging
jet and microchannel heat sinks can provide the necessary cooling
with less than 0.1Wof pumping power. Microchannels achieve this
heat transfer target with such low pumping power by the relatively
high pressure drop being offset by a low volumetric flow rate. In
contrast, impinging jet heat sinks require a lower pressure drop
and higher volumetric flow rate. From a practical point of view,
lower operating pressure and larger mass flow rates are desirable
characteristics, since they will be less prone to leakage and will provide
better temperature uniformity across the heated component.n | en |
dc.description.sponsorship | This work
was supported by the Center for Telecommunications Value-Chain Research
(CTVR), a CSET of Science Foundation Ireland. This work was recommended
for publication by Associate Editor B. Sammakia upon evaluation of the reviewers
comments | en |
dc.format.extent | 347 - 357 | en |
dc.format.extent | 540388 bytes | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en | en |
dc.publisher | IEEE | en |
dc.relation.ispartofseries | IEEE Transactions on Components and Packaging Technologies | en |
dc.relation.ispartofseries | 32 | en |
dc.relation.ispartofseries | 2 | en |
dc.rights | Y | en |
dc.subject | Impinging jet cooling, liquid cooling, microchannel cooling. | en |
dc.title | A thermal-hydraulic comparison of liquid microchannel and impinging liquid jet array heat sinks for high power electronics cooling | en |
dc.type | Journal Article | en |
dc.type.supercollection | scholarly_publications | en |
dc.type.supercollection | refereed_publications | en |
dc.identifier.peoplefinderurl | http://people.tcd.ie/arobins | |
dc.contributor.sponsor | Science Foundation Ireland | |
dc.identifier.uri | http://hdl.handle.net/2262/31928 | |