dc.contributor.author | MOORE, ROBERT | en |
dc.contributor.author | PEROVA, TANIA | en |
dc.date.accessioned | 2010-02-01T12:58:29Z | |
dc.date.available | 2010-02-01T12:58:29Z | |
dc.date.created | 24-27 June 2004 | en |
dc.date.issued | 2004 | en |
dc.date.submitted | 2004 | en |
dc.identifier.citation | J. McCarthy, S. Bhattacharya, T.S. Perova, R.A. Moore, H. Gamble, and B. M. Armstrong, Composition and Stress Analysis in Si/SiGe Structures, Proceedings of IEEE 1st International Conference, Acapulko, Mexico, 24-27 June 2004, IEEE, 2004, 226 - 230 | en |
dc.identifier.other | Y | en |
dc.description | PUBLISHED | en |
dc.description | ISBN 0-7803-8532-2 | en |
dc.description | Acapulko, Mexico | en |
dc.description.abstract | Strained Si tecbnology enables improvements in
CMOS performance and functionality via replacement of the
bulk, cubic-crystal Si substrate witb a Si substrate that contains
a tetragonally distorted, biaxially strained Si thin f h at the
surface. Here we use micro-Raman spectroscopy to enable us to
characterise growth processes of strained silicon, and to
characterise the resulting level of strainlstress in the silicon and
the effect it has on the underlying layer of graded SiGe. | en |
dc.format.extent | 226 - 230 | en |
dc.format.mimetype | application/pdf | |
dc.language.iso | en | en |
dc.publisher | IEEE | en |
dc.rights | Y | en |
dc.subject | Electronic & Electrical Engineering | |
dc.title | Composition and Stress Analysis in Si/SiGe Structures | en |
dc.title.alternative | Proceedings of IEEE 1st International Conference | en |
dc.type | Conference Paper | en |
dc.type.supercollection | scholarly_publications | en |
dc.type.supercollection | refereed_publications | en |
dc.identifier.peoplefinderurl | http://people.tcd.ie/rmoore | en |
dc.identifier.peoplefinderurl | http://people.tcd.ie/perovat | en |
dc.identifier.rssinternalid | 14122 | en |
dc.identifier.doi | http://dx.doi.org/10.1109/ICEEE.2004.1433882 | en |
dc.identifier.rssuri | http://dx.doi.org/10.1109/ICEEE.2004.1433882 | |
dc.contributor.sponsor | Higher Education Authority (HEA) | en |
dc.identifier.uri | http://hdl.handle.net/2262/36666 | |