dc.contributor.author | NAYDENOV, BORISLAV | en |
dc.date.accessioned | 2014-01-13T10:13:02Z | |
dc.date.available | 2014-01-13T10:13:02Z | |
dc.date.issued | 2013 | en |
dc.date.submitted | 2013 | en |
dc.identifier.citation | Borislav Naydenov and John J. Boland, Engineering the electronic structure of surface dangling bond nanowires of different size and dimensionality, Nanotechnology, 24, 2013, 275202- | en |
dc.identifier.other | Y | en |
dc.description | PUBLISHED | en |
dc.description.abstract | We demonstrate how the local density of electronic states evolves as the size and dimensionality of surface dangling bond nanowires are modified. These wires were fabricated using the probe of a scanning tunneling microscope on a hydrogen passivated n-type Si(100)-(2 ? 1) surface. We demonstrate that by varying the number and arrangement of dangling bonds on the surface it is possible to arbitrarily engineer the electronic characteristic of a surface nanowire from that of a semiconductor with a controllable band gap to that of a metal. | en_US |
dc.format.extent | 275202 | en |
dc.language.iso | en | en |
dc.relation.ispartofseries | Nanotechnology | en |
dc.relation.ispartofseries | 24 | en |
dc.rights | Y | en |
dc.subject | Condensed matter: electrical | en_US |
dc.subject | magnetic and optical Surfaces | en_US |
dc.subject | Interfaces and thin films | en_US |
dc.subject | Nanoscale science and low-D systems | en_US |
dc.title | Engineering the electronic structure of surface dangling bond nanowires of different size and dimensionality | en |
dc.type | Journal Article | en |
dc.type.supercollection | scholarly_publications | en |
dc.type.supercollection | refereed_publications | en |
dc.identifier.peoplefinderurl | http://people.tcd.ie/naydenob | en |
dc.identifier.rssinternalid | 90612 | en |
dc.identifier.doi | http://dx.doi.org/10.1088/0957-4484/24/27/275202 | en |
dc.rights.ecaccessrights | OpenAccess | |
dc.subject.TCDTheme | Nanoscience & Materials | en |
dc.contributor.sponsor | Science Foundation Ireland (SFI) | en |
dc.contributor.sponsorGrantNumber | 06/IN.1/I106 | en |
dc.identifier.uri | http://hdl.handle.net/2262/67812 | |