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dc.contributor.authorNAYDENOV, BORISLAVen
dc.date.accessioned2014-01-13T10:13:02Z
dc.date.available2014-01-13T10:13:02Z
dc.date.issued2013en
dc.date.submitted2013en
dc.identifier.citationBorislav Naydenov and John J. Boland, Engineering the electronic structure of surface dangling bond nanowires of different size and dimensionality, Nanotechnology, 24, 2013, 275202-en
dc.identifier.otherYen
dc.descriptionPUBLISHEDen
dc.description.abstractWe demonstrate how the local density of electronic states evolves as the size and dimensionality of surface dangling bond nanowires are modified. These wires were fabricated using the probe of a scanning tunneling microscope on a hydrogen passivated n-type Si(100)-(2 ? 1) surface. We demonstrate that by varying the number and arrangement of dangling bonds on the surface it is possible to arbitrarily engineer the electronic characteristic of a surface nanowire from that of a semiconductor with a controllable band gap to that of a metal.en_US
dc.format.extent275202en
dc.language.isoenen
dc.relation.ispartofseriesNanotechnologyen
dc.relation.ispartofseries24en
dc.rightsYen
dc.subjectCondensed matter: electricalen_US
dc.subjectmagnetic and optical Surfacesen_US
dc.subjectInterfaces and thin filmsen_US
dc.subjectNanoscale science and low-D systemsen_US
dc.titleEngineering the electronic structure of surface dangling bond nanowires of different size and dimensionalityen
dc.typeJournal Articleen
dc.type.supercollectionscholarly_publicationsen
dc.type.supercollectionrefereed_publicationsen
dc.identifier.peoplefinderurlhttp://people.tcd.ie/naydenoben
dc.identifier.rssinternalid90612en
dc.identifier.doihttp://dx.doi.org/10.1088/0957-4484/24/27/275202en
dc.rights.ecaccessrightsOpenAccess
dc.subject.TCDThemeNanoscience & Materialsen
dc.contributor.sponsorScience Foundation Ireland (SFI)en
dc.contributor.sponsorGrantNumber06/IN.1/I106en
dc.identifier.urihttp://hdl.handle.net/2262/67812


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