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dc.contributor.authorBoland, John
dc.date.accessioned2019-06-17T12:19:39Z
dc.date.available2019-06-17T12:19:39Z
dc.date.issued2017
dc.date.submitted2017en
dc.identifier.citationMills, S., Sader, J.E., Boland, J.J, Material characterisation of nanowires with intrinsic stress, Nanotechnology, 28, 35, 2017en
dc.identifier.otherY
dc.description.abstractWhen fabricating nanowires in a doubly-clamped beam configuration it is possible for a residual axial stress to be generated. Here, we show that material characterisation of metal and semiconductor nanowires subjected to residual axial stress can be problematic. Benchmark measurements of the Young’s modulus of nanowires are performed by sectioning a doublyclamped nanowire into two cantilevered wires, eliminating residual axial stress. Use of models for doubly-clamped beams that incorporate the effects of residual stress are found to lead to ambiguity in the extracted Young’s modulus as a function of displacement fit range, even for nanowires with no residual stress. This is due to coupling of bending and axial stress effects at small displacements, and the limited displacement range of force curves prior to fracture or plastic deformation. This study highlights the importance of fabricating metal and semiconductor nanowires that exhibit little or no residual axial stress for materials characterisation.en
dc.language.isoenen
dc.relation.ispartofseriesNanotechnology;
dc.relation.ispartofseries28;
dc.relation.ispartofseries35;
dc.rightsYen
dc.subjectResidual stressen
dc.subjectdoubly-clampeden
dc.subjectNanowiresen
dc.subjectYoung’s modulusen
dc.subjectEuler-Bernoullien
dc.titleMaterial characterisation of nanowires with intrinsic stressen
dc.typeJournal Articleen
dc.type.supercollectionscholarly_publicationsen
dc.type.supercollectionrefereed_publicationsen
dc.identifier.peoplefinderurlhttp://people.tcd.ie/jboland
dc.identifier.rssinternalid178424
dc.identifier.doihttp://iopscience.iop.org/article/10.1088/1361-6528/aa7c31
dc.rights.ecaccessrightsopenAccess
dc.subject.TCDThemeNanoscience & Materialsen
dc.identifier.urihttp://hdl.handle.net/2262/88103


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